Towards a high power RF system-in-package technology

Abstract

This thesis investigates a System-in-Package (SiP) solution for future Radio Frequency (RF) applications. The work focuses on the development of a design and evaluation methodology for future RF-SiP implementation using electromagnetic simulation. The study includes the investigation of different material properties and their impact on important SiP building blocks and overall RF performance. A particular focus is placed on the evaluation of a novel silicon carbide (SiC) interposer technology currently under development. Passive RF components, including inductors and filters, were designed and implemented on the interposer in order to evaluate its suitability for RF applications. MultiTech simulations in ADS RFPro were used as a design tool and method for evaluating RF-SiP structures, material properties, and flip-chip integrated components. In addition, an evaluation board with a calibration kit for future RF-SiP measurements was designed as part of the work. The results provide insights into the design and development of future RF-SiP systems. The findings indicate that ADS and MultiTech provide support for RFSiP development and evaluation, although several limitations were identified during the design and simulation process. Furthermore, the investigated interposer and the investigated passive components demonstrates promising characteristics for RF applications, while flip-chip integration affects needs to be accounted for. Overall, the findings contribute to a broader understanding of RF-SiP design process and provide insights to the development of future broadband and high-power RF-SiP solutions.