MCM Design of Electromagnetic Field Vector Sensing Radio receiver for Space Applications

Abstract

Miniaturization of electronics could play an important role in Space applications due to the better thermal and electrical characteristics,very low mass as compared to printed circuit boards (PCB). Since mass is an important cost driver in all space missions, miniaturization may ultimately decrease the cost of satellite. The current work is to upgrade an already existing Electromagnetic field vector sensor (EFVS), on a PCB to Silicon and Low temperature cofired ceramic (LTCC) modules using Multichip module technology (MCM). EFVS is a three channel digital high frequency sampling system, which measures the three-dimensional electric and magnetic fields. MCM is a novel technology used to miniaturize electronics by achieving high density packaging, where multiple bare dies are connected on to the same substrate. The design and layouts for both silicon and LTCC modules has been done and are ready for fabrication. The size of the board has been reduced by 75 percent whereas the mass is expected to be reduced by 90 percent. Chapter 1 deals with the introduction of Microlink-1, a nanosatellite and the different instruments on it, of which EFVS is a constituent. Chapter 2 discusses the measurement principles of 3 dimensional vector fields. Chapter 3 discusses the design and functionality of the EFVS. Emphasis on MCM technology is given in chapter 4. Chapter 5 gives a detailed description of design considerations and design of layouts of both silicon and LTCC modules. A brief description of the fabrication technologies to be used for fabrication of both the modules is presented in chapter 6. The EFVS has applications in Astrophysics, Astroparticle physics, Space Plasma Physics, Low frequency Radio astronomy measuring the three dimensional electric and magnetic fields.