Reliability study of one TSV based ultra-thin fingerprint sensor package: An improvement of the packaging process
Typ
Examensarbete för masterexamen
Program
Product development (MPPDE), MSc
Publicerad
2019
Författare
Zhang, Rui
Modellbyggare
Tidskriftstitel
ISSN
Volymtitel
Utgivare
Sammanfattning
Through silicon via (TSV) technology is a vertical electrical interconnection that is
etched into a silicon wafer or a die. The primary benefit of using TSV technology
is to shortening the interconnection path and further reducing the die thickness.
Therefore, the TSV based packages are widely used in fingerprint sensors. In Fingerprint
Cards AB (FPC), a new TSV based ultra-thin fingerprint sensor package
along with an improvement of the manufacturing process was developed, which enables
to further reduce the thickness of the fingerprint sensor package.
This thesis report is focused on the reliability study of a newly designed TSV based
ultra-thin fingerprint sensor package, to verify and check if it can pass the qualification
standards for the consumer electronics products. The new package was designed
based on one of the widely-used fingerprint senor package in FPC. A design
of experiments (DOE) study regarding the design of the new TSV based ultra-thin
fingerprint sensor package was conducted, a set of changes in design parameters
were generated according to the requirements of both FPC and the phone original
equipment manufacturers (OEMs). The reliability of the new TSV based fingerprint
sensor package was analyzed and compared to the reference package by conducting
the FEA simulations, such as warpage simulation, ball drop simulation and bending
simulation.
Based on analysis of the result of the FEA simulations, the TSV based ultra-thin
fingerprint sensor has been proved to be qualified to pass the relevant in-house qualification
standards of Fingerprint Cards AB, but new studies need to be continued
and engineering samples need to be built and test if the phone OEMs want to apply
this new TSV based fingerprint sensor to its consumer electronics products.
Beskrivning
Ämne/nyckelord
TSV, Packaging design, Process improvement, Fingerprint sensor, DOE,