Pulse-Electroplating: Process Parameters and Their Influence on the Formed Microstructure

Abstract

Nickel-layers with a thickness of a few tens of microns were produced by pulseelectrodeposition using two electrolytic baths (I and II). The influence of temperature and current density on the obtained microstructure was investigated using Electrolyte I while for the effect of Nickel Sulfamate concentration and current density was analyzed using Electrolyte II. In addition, Polyamide fibers included in HybrixTM sandwich material were coated by pulseelectrodeposition and afterwards investigated. Electrodeposited Nickel was examined in the asprepared state by XRD and SEM. With the help of EBSD technique, orientation maps, pole figures and inverse pole figures were obtained for all samples. Different microstructures were obtained by changing temperature and current density. As a result, the average grain size of asdeposited Nickel varied from 30 nm to 200 nm, depending on plating conditions. Moreover, a <100>-texture is obtained independently of plating conditions. In contrast, when the effect of Nickel Sulfamate concentration and current density was investigated, no preferred orientation, i.e. a weak <110>-texture is attained independently on Nickel Sulfamate concentration and current density. The average grain size of the produced microstructures was in the range of 40 to 50 nm. Concerning the electrodeposition on Polyamide fibers, a Nickel coating was successfully deposited on the fibers.