Simulering av värmeöverföring från en elektronikbox

Abstract

When more and more computing power is needed in todays vechicles, with faster and more energy consuming computers the cooling of these computers becomes a problem. Requirements on vibration resistance and protection against moisture leads to a encapsulation for these computers, which complicates the cooling considerably. The work has been carried out at Cpac systems AB and has been aimed at simulating an electronic box that is under development. This is to ensure that heat transfers becomes sufficient and that no electronic components will be damaged due to high temperatures. Several correct simulation models of existing electronics boxes were developed. The simulation models were verified by performing practical experiments which showed that the simulation models were in good correspondence with reality. A new simulation model for the new electronics box was developed with the same boundary conditions and the values received from previous experiments. The simulation model of the new electronic box that has been developed can be used as a basis for decisions regarding: • Selection of Components • Component placement • Enhancement of the box design Since the new electronic box is not yet produced practical experiments can not be performed to verify the result from the simulaton. Which becomes a limitation in this project.